Ting Bo He

President at Huawei Technologies Co., Ltd.

Ting Bo He

Ting Bo He

President at Huawei Technologies Co., Ltd.

Biography

Director, President of HiSilicon, President of the 2012 Laboratories

Born in 1969, Ms. He holds a master's degree from Beijing University of Posts and Telecommunications. She joined Huawei in 1996 and has since served as Chief ASIC Engineer, R&D Director of HiSilicon, and Vice President of the 2012 Laboratories. Currently, she serves as President of HiSilicon and President of the 2012 Laboratories.

Overview
Career Highlights

Huawei Technologies Co., Ltd.

RelSci Relationships

226

Number of Boards

2

Birthday

01/01/1969

Age

51

Relationships
RelSci Relationships are individuals Ting Bo He likely has professional access to. A relationship does not necessarily indicate a personal connection.

Founder at Huawei Technologies Co., Ltd.

Relationship likelihood: Strong

Chief Financial Officer at Huawei Technologies Co., Ltd.

Relationship likelihood: Strong

Rotating Chairman at Huawei Technologies Co., Ltd.

Relationship likelihood: Strong

Rotating Chairman at Huawei Technologies Co., Ltd.

Relationship likelihood: Strong

Executive Director & President-Human Resources at Huawei Technologies Co., Ltd.

Relationship likelihood: Strong

Executive Director & President-Products & Solutions at Huawei Technologies Co., Ltd.

Relationship likelihood: Strong

Executive Director & President-Strategy Marketing at Huawei Technologies Co., Ltd.

Relationship likelihood: Strong

Chief Executive Officer of Huawei Device & President of the Russia Region at Huawei Technologies Co., Ltd.

Relationship likelihood: Strong

President-European Region at Huawei Technologies Co., Ltd.

Relationship likelihood: Strong

Chairman & Chief Executive Officer at Huawei Device (Shenzhen) Co., Ltd.

Relationship likelihood: Strong

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Ting Bo He
President at Huawei Technologies Co., Ltd.
Education
Masters Unknown

Beijing University of Posts and Telecommunications is a school in Beijing.

Career History
President
1996 - Current

Huawei Technologies Co., Ltd. manufactures telecommunications equipment and broadband networking products. It offers voice and data switching platforms for communications service providers. The firm provides information and communications technology portfolio of end-to-end solutions in telecom and enterprise networks, devices, and cloud computing. It also makes optical networking systems, wireless products, corporate networking equipment, network management, and messaging software products. The company was founded by Ren Zheng Fei in 1987 and is headquartered in Shenzhen, China.

President, Head-Research & Development
Prior

HiSilicon Technologies Co., Ltd. engages in the provision of chipset solutions. It products fabless semiconductor and integrated circuit. Its solutions consist of surveillance, mobile camera, set top box, display, home network, kirin, balong, and NarrowBand IoT. The company was founded in 1991 and is headquartered in Shenzhen, China.

Other Affiliations
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