Powered by

Applied Materials and BE Semiconductor Industries to Accelerate Chip Integration Technology for the Semiconductor Industry

Oct 22, 2020 - GlobeNewswire

Hybrid Bonding Hybrid bonding uses direct, copper-to-copper interconnects to increase the I/O density while shortening the lengths of the wiring between chiplets, thereby improving overall performance, power and cost. SANTA CLARA, Calif. and DUIVEN, The Netherlands, Oct. 21, 2020 (GLOBE NEWSWIRE) -- Applied Materials, Inc. and BE Semiconductor Industries N.V. (Besi) today announced an agreement to develop the industry’s first complete and proven equipment solution for die-based hybri...