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-First system-in-package EDA solution launched

Feb 05, 2018 - ENP Newswire

Advanced Semiconductor Engineering and Cadence Design Systems have announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-substrate (FOCos) multi-die packages.

The solution consists of the SiP-id (System-in-Package - intelligent design) design kit, an enhanced reference flow including IC packaging and verification tools from Cadence, and a new methodology that aggregates the requirements of...