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Ulvac introduces new dry etching system for 600mm packaging substrates

Mar 21, 2017 - Marketline Newswire

Japanese vacuum equipment manufacturer Ulvac has introduced new dry etching system for 600mm advanced packaging substrates, in a bid to provide uniform Descum process and Ti etching process.

The company has developed the new NA-1500 dry etching system to support the mass-produced packaging process.The new dry etching system can be used in applications, including Descum, Desmear, surface treatment, pretreatment for wet process such as plating and underfill.In addition, the system can be use

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